The goal of this activity the development of spiking skin for sensory feedback on prosthetic devices. The fellow will first evaluate the properties of different transduction methods amenable to spiking implementation and their fit to the needs of the prosthetic application, starting from the characterization of a skin prototype integrated on iLimb (Ossur, previously developed by UNIBI). A novel methodology based on printed nanowires on flexible substrates will be then used to develop neural nanowire FET and memristor assemblies. This technique will be then used to develop functional neural element devices and components via modelling and practical fabrication. The in-depth investigation will involve the heterogeneous integration of circuits on flexible substrates, printing of neural nanowire FET based circuits with well controlled print dynamics, electro-mechanical characterization and modeling. Custom contact print set up will be used to fabricate neural nanowire FETs circuits based neural backplane. The resulting neuromorphic flexible large area skin will be integrated and validated on prosthetic devices

Expected Results

ESR8 will go beyond the current state of the art by developing large area printable neuromorphic nanowire based backplane circuits for e-skin, and integrating it on prosthetic devices. The flexible skin will be designed in a way that it can be used in the fingertips (high resolution for manipulation) but also on large areas, to cover most of the prosthesis.

Planned Secondments

  • IIT-iCub:
    to study neuromorphic circuits for POSFET, capacitive sensors;
  • EPFL:

    to try tactile sensors on prosthesis; 

  • OSSUR:

    to test sensors on a prosthetic device;

Enrolments (in Doctoral degree/s)

University of Glasgow


R. Dahiya, C. Bartolozzi, S. Micera, SO from Ossur


ESR8: Optimization and integration of spiking tactile sensors on prosthetic devices
This project has received funding from the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation programme (Grant agreement No. 813713 ).
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